STMicroelectronics Solutions to Make Everything Smarter at Electronica 2016

STMicroelectronics will demonstrate the power of technology to make manufacturing, driving, and devices smarter and securely connected at Electronica 2016 in Munich, Nov 8-11.
 
ST’s Industry 4.0 Smart Factory demonstration gives insights into the semiconductor solutions supporting the future of manufacturing: more efficient, automated, safer and flexible.
 
ST’s STM32 microcontroller portfolio allows designers to find the ideal host for their applications from among more than 700 devices ranging from the ultra-energy-conscious to the highest-performing. The demos at Electronica will also present ST’s portfolio of sensors, including advanced MEMS motion, pressure, and acoustic sensors as well as temperature, touch, and proximity sensors.
 
The potential for drone technology reaches well beyond consumer applications, into industry, agriculture, and logistics to name a few. ST is presenting a complete offering, including navigation solutions, the STSPIN motor-drive portfolio, sensors for motion control and stability, as well as camera and machine-vision technologies that enhance the variety of applications drones can address.
 
With security a key concern for Internet of Things applications, ST’s smartcard expertise and a portfolio of secure elements and microcontrollers provide low-power, high-performing protection suitable for use in embedded systems. ST’s on-stand demonstrations also present the STSAFE secure component portfolio as well as ST25 RFID and NFC dynamic tags, which make asset tracking and authentication more convenient and efficient.
 
ST is exhibiting the strength of its support ecosystem and tool portfolio that includes the variety of competitively priced STM32 Nucleo boards now available.
 
Visitors to the Smart Driving area of ST’s booth can see how ST’s broad range of chips and controllers for advanced driver assistance systems (ADAS) enable further progress toward autonomous driving. Technologies represented include V2X (Vehicle-to-Vehicle and Vehicle-to-Infrastructure) communication, machine vision, radar, automotive-qualified MEMS, and navigation with the TESEO family of Systems-on-Chips.